Αναζήτηση | La Lingua Nostra

πρόσθεσε ένα νέο άρθρο άλλο

2025-12-17 17:51:07 -

How Automation Is Transforming the Global Wire Bonding Market

The global wire bonding market continues to play a critical role in the semiconductor value chain, supporting the assembly and packaging of integrated circuits across a wide range of applications. In 2024, the wire bonding market was valued at US$ 4.5 billion and is projected to reach US$ 8.0 billion by 2035, expanding at a CAGR of 5.3% from 2025 to 2035. This steady growth reflects the...

0 Σχόλια 0 Μοιράστηκε 18 Views 0 Προεπισκόπηση