The global wire bonding market continues to play a critical role in the semiconductor value chain, supporting the assembly and packaging of integrated circuits across a wide range of applications. In 2024, the wire bonding market was valued at US$ 4.5 billion and is projected to reach US$ 8.0 billion by 2035, expanding at a CAGR of 5.3% from 2025 to 2035. This steady growth reflects the...
Arabic
French
Spanish
Portuguese
Deutsch
Turkish
Dutch
Italiano
Russian
Romaian
Portuguese (Brazil)
Greek