According to a new report from Intel Market Research, the global Package Substrates market was valued at USD 12,182 million in 2025 and is projected to reach USD 22,191 million by 2034, growing at a strong CAGR of 8.7% during the forecast period (2025-2034). This expansion is driven by surging demand for advanced semiconductor packaging solutions across data centers, AI accelerators, and...
Global Package Substrates Market was valued at USD 12,182 million in 2026 and is projected to reach USD 22,191 million by 2033, expanding at a CAGR of 8.7% during the forecast period. Market growth is driven by increasing demand for advanced semiconductor packaging technologies supporting artificial intelligence (AI), high-performance computing (HPC), data centers, and 5G infrastructure....
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