According to a new report from Intel Market Research, the global Semiconductor Thermal Interface Materials market was valued at USD 1.17 billion in 2025 and is projected to reach USD 2.42 billion by 2034, growing at a strong CAGR of 11.1% during the forecast period (2026-2034). This growth is driven by escalating demand for efficient thermal management solutions across high-performance...
According to a new report from Intel Market Research, the global ABF substrate market was valued at USD 4.89 billion in 2024 and is projected to reach USD 9.55 billion by 2032, growing at a strong CAGR of 10.6% during the forecast period (2025-2032). This expansion reflects the surging demand for advanced semiconductor packaging solutions driven by artificial intelligence, high-performance...
According to a new report from Intel Market Research, the global Package Substrates market was valued at USD 12,182 million in 2025 and is projected to reach USD 22,191 million by 2034, growing at a strong CAGR of 8.7% during the forecast period (2025-2034). This expansion is driven by surging demand for advanced semiconductor packaging solutions across data centers, AI accelerators, and...
The world is currently in the middle of a massive architectural shift. Just as the steam engine defined the industrial revolution and the transistor defined the digital age, Artificial Intelligence (AI) is redefining the 21st century. However, AI isn’t just lines of code and neural networks; it is physical. It requires "brains specialized hardware capable of processing billions of...