Through-Glass Via (TGV) Interposers Gain Market Traction with Enhanced Electrical and Thermal Performance
The global glass interposers market size was valued at USD 118.26 million in 2024, growing at a CAGR of 12.5% from 2025 to 2034. This robust expansion reflects the semiconductor industry’s accelerating shift toward advanced packaging solutions that overcome the physical and economic limitations of traditional scaling. Glass interposers—thin, chemically strengthened glass substrates...
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